Ceramics-Silikáty 36, (2) 93 - 100 (1992) |
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MECHANICS OF DELAMINATION OF THIN FILMS UNDER THERMAL AND RESIDUAL COMPRESSIVE S TRESSES
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Menčík Jaroslav
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Research Institute of Foodstuff and Refrigeration Technology, Resslova 956, 50187 Hradec Králové, Czechoslovakia
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An analysis has been made of the delamination of thin films due to uniformly distributed thermal and residual compressive stresses and local thermal stresses arising at the occurrence of a hot spot above an interface crack in heated components. Expressions have been derived for calculation of the strain energy release rate during growth of one dimensional and circular delamination, and the conditions for start and growth of these delaminations have been analysed. |
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