ISSN 0862-5468 (Print), ISSN 1804-5847 (online) 

Ceramics-Silikáty 69, (1) 42 - 53 (2025)


APPLICATION AND POTENTIAL OF SILICON NITRIDE CERAMICS IN ARTIFICIAL JOINT REPLACEMENTS
 
Zhang Zhiqiang, Tang Jun
 
Chinese Medicine Hospital of Wuyi County, Wuyi, Zhejiang Province, 321200, China

Keywords: Biocompatibility, Tribology, Osseointegration, Ceramic composites, Orthopaedic biomaterials
 

This review examines the application and potential of silicon nitride ceramics in artificial joint replacements. Silicon nitride offers a unique combination of mechanical strength, wear resistance, and biocompatibility, making it an attractive alternative to traditional materials used in orthopaedic implants. The chemical structure and composition of silicon nitride contribute to its exceptional properties, including high flexural strength, fracture toughness, and hardness. Various manufacturing techniques, such as powder synthesis, densification, and surface modifications, are discussed, highlighting the challenges and advancements in producing complex geometries suitable for joint replacements. The tribological behaviour of silicon nitride in simulated joint environments demonstrates remarkably low wear rates and friction coefficients, potentially leading to improved implant longevity. In vitro and in vivo studies have shown promising results regarding silicon nitride’s biocompatibility, osseointegration capabilities, and potential antibacterial properties. While silicon nitride shows great promise, challenges such as stress shielding and limited long-term clinical data are addressed. The review also explores ongoing research efforts aimed at optimising silicon nitride’s performance in joint replacements, including the development of composites and advanced manufacturing techniques. Finally, the potential expansion of silicon nitride applications beyond hip and knee replacements to other orthopaedic and medical fields is considered, emphasising the material’s versatility and future prospects in biomedical engineering.


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doi: 10.13168/cs.2024.0064
 
 
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